What is Chip-On-Board?
Chip-on-Board Assembly involves the aluminium wire bonding for interconnection between Integrated Circuit (IC) and Printed Circuit Board (PCB)/Smart Cards. In this division, we provide a full-scale COB services with the latest state-of-the-art aluminium wire bonding. We have offered COB services and gained vast experience in building products ranging from watch modules to smart card modules as well as rigid PCB.


Our factory is geared towards technically medium volume electronic manufacturing specializing in a full-scale COB assembly. We operate 6 wire bonding machines with a bonding capacity of 110K die's per month. At 100 wires average per bond, that equates to a monthly bonding capacity of eleven million wires.


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